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Introduction to SMT patch process

Article source:NewsEditor:Dongguan Taijie Electronic Technology Co., Ltd Issuing time:2021-09-28

The basic process elements of SMT include: screen printing (or dispensing), mounting (curing), reflow welding, cleaning, testing and repair.
1. Silk screen printing: its function is to leak solder paste or patch adhesive onto the PCB pad to prepare for the welding of components. The equipment used is screen printing machine (screen printing machine), which is located at the front end of SMT production line.
2. Dispensing: it drops glue on the fixed position of PCB board, and its main function is to fix components on PCB board. The equipment used is a dispensing machine, which is located at the front end of the SMT production line or behind the testing equipment.
3. Mounting: its function is to accurately install the surface assembled components to the fixed position of PCB. The equipment used is the mounter, which is located behind the screen printing machine in the SMT production line.
4. Curing: its function is to melt the patch adhesive, so as to firmly bond the surface assembled components with the PCB board. The equipment used is a curing furnace, which is located behind the mounter in the SMT production line.
5. Reflow soldering: its function is to melt the solder paste and firmly bond the surface assembled components with the PCB board. The equipment used is the reflow furnace, which is located behind the mounter in the SMT production line.
6. Cleaning: its function is to remove the welding residues harmful to human body, such as flux, on the assembled PCB. The equipment used is a cleaning machine, and the position can be fixed, online or offline.
7. Inspection: its function is to inspect the welding quality and assembly quality of the assembled PCB. The equipment used include magnifying glass, microscope, on-line tester (ICT), flying needle tester, automatic optical inspection (AOI), X-ray inspection system, function tester, etc. The position can be configured in the appropriate place of the production line according to the needs of detection.
8. Repair: its function is to rework the PCB board that is detected to be faulty. The tools used are soldering iron, repair workstation, etc. Configure anywhere in the production line.